The Q-300 TCT 3D-ESPI System is designed for complete three dimensional and highly sensitive thermal expansion measurement and strain analysis of materials and components.

Thermal Expansion Measurement of Q-300 TCT 3D-ESPI System

– Characterization of electronic components and determination of CTE

The 3D electronic speckle interferometry is a very powerful tool to investigate the thermal expansion of MEMS and electronic components.

Due to the full field measuring technique, combined with a high resolution the determination of critical areas and hot spots in electronic components is very easy.

  • Full field, 3-dimensional measurement without contact and marking.
  • Delivers CTE and thermal strain.
  • Measurement of electronic components and materials.