Elektronic Speckle Pattern
The Q-300 3D-ESPI System enables complete three dimensional and highly sensitive deformation and strain analysis of any component.
Strain and Stress Measurement of Q-300 3D-ESPI System
- Full field, 3-dimensional measurement without contact and marking
- Delivers Youngs-Modulus and Poisson Ratio
- Measurement of any material, also of unisotropic material
The Q-300 3D-ESPI System is best suited for the development and testing of complex components and structures in electronics, automobile design, machining and materials research. It is ideal for the experimental verification of analytical and numerical calculation techniques.