Optical measurement solutions for strain & stress measurements, based on Elektronic Speckle Pattern Interferometry (ESPI).

Effective development of advanced materials and components requires an understanding of their behaviour under load at various conditions. Optical full-field measurement techniques are increasingly being used in material testing, fracture mechanics and vibration analysis.

The Dantec Dynamics Elektronic Speckle Pattern Interferometry (ESPI) Systems are designed for complete three dimensional, full field and highly sensitive displacement and strain and stress analysis.

The measurement is performed non-contact on the whole measuring area on nearly any material and component.

Elektronic-Speckle-Pattern-Interferometry-ESPI

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